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Semiconductor Solutions
Machine vision
Industrial robots
Direct drive motor
Mobile robot
Eutectic machine
Direct drive motor
Structure design compatibility is strong, need to meet the multi-process, multi-chip one-machine production The ultra-high speed packaging and fitting must also ensure the high precision of the overall shafting movement The overall accuracy of the gantr

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Dinglongmen Marble XYZ Platform
Direct drive motor
XY + Z-axis full direct drive marble platform, Z-axis heavy-duty long stroke [65Kg & 200mm] Customer-supplied ACS drive and control, our platform is tested and accepted with the Hiwin second-generation CDHD2 The perpendicularity error of the XYZ-axis sy

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UV etching machine
Direct drive motor
With high precision lead screw module THK component - Z axis with external second encoder system design, improve the electrical accuracy of Z axis High performance coreless motor +20 nm grating position feedback system, SP IKO roller guide configuration,

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UV etching machine
Direct drive motor
XY direct drive heavy-duty space orthogonal cross marble fixed gantry platform, XZ stacked cross side-mounted Customer-supplied ACS drive control, tested and delivered for acceptance with Galil second-generation CDHD2 The perpendicularity error between

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Laser marking equipment
Direct drive motor
Electrical materials such as stator, photoelectric switch, grating ruler and driver all have UL certification certificates and are provided. EtherCAT bus driver with STO function is also provided with certification certificates. The absolute value positio

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Wafer dicing saw
Direct drive motor
The axial and radial runout of the 8-inch wafer dicing saw does not exceed 3μm. Liquid is continuously sprayed during the dicing process, so the motor must be waterproof and there should be no water mist in the encoder disk to prevent encoder errors. The

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Wafer dicing
Direct drive motor
The equipment accuracy requirements are as follows: the repeat positioning accuracy should be ≤ ±0.5 μm. The product process requirements are: the single-axis yaw straightness should be ≤ 2 μm, and the pitch straightness should be ≤ 8 μm. The speed fluctu

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