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Wafer dicing saw
Wafer dicing saw
Customer requirements

The axial and radial runout of the 8-inch wafer dicing saw does not exceed 3μm. Liquid is continuously sprayed during the dicing process, so the motor must be waterproof and there should be no water mist in the encoder disk to prevent encoder errors. The

Advantages of the Plan

The motor adopts a labyrinth-type waterproof design and is fully sealed with glue to prevent water mist from entering the interior. 

The LHO-140-90 motor is adopted. During the entire assembly process, all inspection items are recorded in a table and through video, ensuring the installation of bearings and read heads. 

The end face of the finished motor is ground with a grinding machine to ensure the end runout of the motor.