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Wafer dicing
Wafer dicing
Customer requirements

The equipment accuracy requirements are as follows: the repeat positioning accuracy should be ≤ ±0.5 μm. The product process requirements are: the single-axis yaw straightness should be ≤ 2 μm, and the pitch straightness should be ≤ 8 μm. The speed fluctu

Advantages of the Plan

The main body is made of natural marble and combined with SP-level guide rails to ensure the repeatability of positioning accuracy and straightness. 

The yaw straightness adjustment uses a laser interferometer as the measuring tool. 

Select the coreless motor of Linghou brand and control the speed fluctuation through ACS with analog quantity control.